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Semiconductor Solutions

Film Thickness and RI Semi Metrology

Specialized thin film metrology systems for wafer and CD metrology
Products

Find the Best Spectrophotometry-Based System for You

FilmTek CD optical critical dimension and advanced film analysis system

FilmTek CD

Optical critical dimension and advanced film metrology system featuring patented multimodal technology for real-time multi-layer stack characterization and CD measurement
詳細はこちら
FilmTek 2000M-TSV metrology platform for CD metrology and advanced film measurements in advanced packaging applications

FilmTek 2000M TSV

Fully automated metrology platform for critical dimension, etch depth, and film thickness measurement over a wide range of TSV designs.
詳細はこちら
FilmTek 2000 PAR-SE multimodal spectroscopic ellipsometry/multi-angle reflectometry system

FilmTek 2000 PAR-SE

最先进的和通用的测量解决方案or nearly any advanced thin film application, with standard and optional features optimized for flexibility
詳細はこちら
FilmTek 6000 PAR-SE state-of-the-art multimodal film metrology system for advanced IC devices

FilmTek 6000 PAR-SE

Advanced multimodal system optimized for monitoring the thickness, refractive index, and stress of film layers in IC devices at the 1x nm design node and beyond
詳細はこちら
Products

FilmTek Systems with Optional CD, Wafer, and TSV Metrology Capabilities

FilmTek 2000M micro-spot DUV-NIR spectroscopic reflectometer

FilmTek 2000M

Benchtop micro-spot size reflectometer for measuring patterned thin to very thick films with a very small spot size, with optional CD metrology on patterned wafers
詳細はこちら
FilmTek 3000M micro-spot reflection-transmission spectrophotometer

FilmTek 3000M

Micro-spot measurement system for patterned, absorbing film samples on transparent substrates and wafers, esp. very thick and/or non-uniform films
詳細はこちら

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