X-Ray Metrology for Silicon Semiconductor
Bruker provides the world’s most advanced and non-destructive X-ray technology solutions for thin-film metrology. Our characterization solutions cover the full range of processing in both logic and memory. We offer specialized systems for identifying substrate defects and performing front end of line control of epi films and high-k dielectrics, as well as dedicated instruments for analyzing metal films and wafer-level packaging bumps. These systems also routinely perform other semiconductor metrology applications for hard disk drive materials, GaN on Si power transistors, and PZT film composition and phase monitoring as well.
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Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.