SEM of coaxial TKD

In 2012,⁽¹⁾In SEM, tem kikuchi diffraction (TKD) technology was put forward for the first time, this technique is also known as t - EBSD, since the technology rapid development, because of its spatial resolution than the standardEBSDAt least one order of magnitude higher.TKD技术需要水平放置或稍微倾斜的电子透明样品。例如：样品放置于垂直或者接近垂直于电子束的位置，一个标准的EBSD探测器从样品平面下方捕获菊池花样。

In recognition of the potential, brooke working with a team of scientists at the university of French lorraine, in order to solve - detector geometry configuration is limited to the sample.Proves that the cooperation is referred to as "coaxial TKD" samples of the new detector geometry principle,⁽²⁾Prompt brooke launched laterOPTIMUS^TMTKDDetector.This new detector has a horizontal screen, can be directly inserted into the electronic transparent samples below, the optical axis of SEM and screen center intersection, so the name is "gang" TKD.The advantages of this configuration is the place where can be the strongest signal again capture the strongest kikuchi patterns of signal output, and minimize the kikuchi pattern distortion induced by geometric projection^(3).

Since 2015, since its launch,OPTIMUS TKDIs the only business is realized in SEM coaxial TKD solution, due to its function, the advantages of this technology is positioned as a leading TKD solution.

Unparalleled performance

Low probe current requirements - OPTIMUS^™TKD support in the use of less than 2 nA probe electric shed, nanoscale spatial resolution and implementation to ensure that the hundreds of points per second test speed, finally realizes the calibration of content and orientation of the sample.

Spatial resolution - use the high-end FE - SEM, spatial resolution for at least 2 nm, OPTIMUS^TMIn less than 10 nm high resolution according to the sample characteristic, sometimes some characteristics and even less than 5 nm (please refer to the following application example).

OPTIMUS^™With all brooke TKD detector headeFlashSeries of EBSD detector standard probe used interchangeably, use the same detector can easily access EBSD and TKD.According to the measurement requirements, such as spatial resolution, well-trained users can in 10 to 15 minutes to switch between inner TKD and EBSD analysis.OPTIMUS^™With our TKD TKD rack (patent EP 2824448 A1).

In order to maximize the instrument performance and analyze the success rate, OPTIMUS^TMThe built-in TKD adoptedARGUS ™System.Its high quality and high solid detector sensitivity can be brought to the user in the SEM classes with nanometer resolution dark field and field, and the image acquisition speed still can keep in 125000 HP/SEC.Although only the qualitative information of material, but the images have revealedMicroscopic structure of the important details, such as orientation and phase contrast, dislocations and stacking defects, in some cases, also can show the residual strain.

Brooke's QUANTAXEDS /EBSD systemOne of the most prized function is that it can be two senior integration technology.Excellent integration can also be used for electron transparent samples, of course, in combination withEFlash FSAnd uniqueXFlash FlatQUAD EDS detectorParticularly strong.The two detector provides unparalleled data quality, space resolutionAnd the signal processing, and USES the patent we have perfectly TKD rack and a new release of X ray shield.

• Spatial resolution of the orientation distribution: 2 - or better
• DF/BF imaging spatial resolution: 1.5 nm or better
• Map the smallest features in analytic: gold ~ 4 nm annealing twin in the samples
• Measurement speed: 630 FPS (frames per second)
• EHT range: 5-30 kV
• Current probe: 95% of no more than 2 nA application requirements

(1)Transmission EBSD from 10 nm domains in a scanning electron microscope, r. Keller and r. Geiss, Journal of Microscopy, Vol. 245, Pt. 3, 2012, pp. 245-251

(2)Orientation mapping by transmission - SEM with an on - axis detector, j. J Fundenberger et all, Ultramicroscopy, 161, 17-22, 2016

(3)A systematic comparison of on - axis and off - axis transmission Kikuchi diffraction, f. Niessen et al, Ultramicroscopy, 186, 158-170, 2018