The plating analysis

Metal coating through surface provide enhanced performance for a wide variety of products, is important for many industrial departments.Metal coating generally have the characteristics of durable, corrosion resistance, in order to protect the substrate material, and to minimize the wear and tear of metal products.Metal coating also can improve the electrical conductivity, torque resistance, resistance to welding, etc.Coating composition and thickness of the quality control is very important to ensure correct coating performance and durability.

When need to strict quality control on metal coating, X-ray fluorescence (XRF) analysis is the best overall solution.brookeM1 MISTRAL microArea of XRF measuring instrument can at the same time provide the coating thickness and coating composition.In addition to the plating analysis, M1 MISTRAL can also measure the metal alloy, plating solution, plastic and many other materials of chemical composition.

M1 MISTRAL equipped with high performance silicon drift detector (SDD), W or Rh micro focus X-ray tube and the user can choose the size of the collimator, measurement point size can be changed from 1.5 mm to 100 microns.In the camera and electric programmable XYZ with the help of the platform, the user can ensure measuring completely in the desired location.

M1 MISTRAL for coatingThe analysis provides the following advantages:

• Coating thickness and composition of the fast and accurate results
• Complete nondestructive analysis
• Able to measure up to 12 layers of multilayer coatings
  
• For automated multipoint plating analysis platform for the rapid programmable XYZ
  
• Easy to use XDATA software allows users to create custom coating structure and calibration
• Comprehensive report function, can rapid development and storage analysis report
• According to ASTM B568 and DIN/ISO 3497 standard for coating analysis

M1 MISTRAL platingThe thickness of the layerApplication range from the single measurement (such as Au on Cu) to complex multi-layer alloy coating.

• General metal processing of single-layer coating;On the base material zinc plating, Ni, Cr, Cu, etc
• On the base material of composite alloy plating (AuNi and ZnNi coating on metal materials)
  
• In a variety of base material (such as Cu or Al) on the electroless plating ni-p coating
• Multi-layer plating;Base on the double layer or multilayer coatings (Cr/Ni/Cu)
• Multilayer electronic plating Au/Ni/Cu, SnAgCu/Cu, Au/Pd/Ni/Cu, etc
• Jewelry plating, such as Au/Ni/Cu, Rh/platinum, PdNi/Brass
• Plating solution analysis