Hysitron PI 85 e scanning electron microscopy (sem) with nanometer indentation instrument extends the range of mechanical tests in situ, makes up for the nanoscale and characterization of the gap between the micron level.The depth sensor designed nano mechanics test system, using scanning electron microscope (SEM, FIB/SEM, PFIB) advanced imaging ability, simultaneously quantitative nano mechanics test.Device extension loading range allows researchers to test accurately size larger or rigid structure.These structures need more load can cause failure or fracture.π85 e纳米压痕仪提供大量材料(从金属和合金到陶瓷、复合材料和半导体材料)的压痕、压缩、拉伸和疲劳测试。PI85E紧凑、低轮廓的架构使其非常适合小腔室SEM、拉曼和光学显微镜、光束线等。
表征近表面,界面和局部微结构以及薄膜的硬度,蠕变,应力松弛,弹性模量和断裂韧性。
Hysitronπ85 e结合了各种测试模式,以表征各种样品的基本力学性能,应力——应变行为,刚度,断裂韧性和变形机制。除了布鲁克行业标准的传感器外,π85 e还提供更高的载荷(250 mN)和更大的位移(150µm)。基于先进控制器实现高带宽的传感器,实现大尺度样品的优化测试,并提供了卓越的性能和灵敏度。
Hysitron PI 85 e system USES patented pressure turn pull (PTP) over module to characterization of one dimensional structure, such as nanowires, and nanotubes, and two dimensional structure, such as independent films.These structures can also through the instrument of optional electronic tensile module electrical characterization.PI85E large displacement range to test the three dimensional lattice under large strain deformation is ideal.
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